PCB Okpomọkụ ihe nchekwa nchekwa

Njirimara nke Sanpu Silicone Sponge Pad:

1.High Temperature Resistance & thermal Stability Properties:Na-adịghị-ntụ ntụ na enweghị ike siri ike mgbe elu ugboro ugboro - okpomọkụ lamination

2.Obere Mmetọ & Enyi na gburugburu ebe obibi:Gafere RoHS na FDA

3. Emechiri{1} cell Structure: N'oge usoro ịsa ahụ, ikuku mmiri nke bọọdụ ahụ na-ewepụta agaghị etinye ya ma nwee ike ịpụ ya nke ọma, na-ebelata ntụpọ dị ka afụ, ntụpọ ọcha na delamination.

4.Chemical kwụsie ike: Ọ naghị emeghachi omume na resin epoxy ma ọ bụ PP prepreg resin na agaghị emebi foil ọla kọpa.

Uru nke Sponge Silicone Dị ka PCB okpomọkụ lamination pad

1. Magburu onwe resilience anụ ahụ iji kwụọ ụgwọ ọla kọpa ọkpụrụkpụ dị iche na osisi unevenness
2. Nkesa nrụgide n'ụdị, obere delamination, ihe efu, ntụpọ ntinye ọla kọpa
3. Nguzogide okpomọkụ dị elu na arụmọrụ okpomọkụ kwụsiri ike
4. E mechiri- Ọdịdị cell maka ezigbo iyuzucha mmiri
5. sọlfọ dị ala & obere volatiles, obere mmetọ, mmepụta dị ọcha
6. Enwere ike ijikwa ya ọzọ, akwadọka{0}} na-eguzogide, ndakọrịta sara mbara maka HDI, ọla kọpa dị arọ, PCB nzọụkwụ

Họrọ Sanpu silicone

1.We bụ ndị mbụ silicone ogbo soplaya

2.We nwere ihe karịrị 16 afọ ahụmahụ nke silicone ogbo mmepụta

3.Mmandatory nyocha tupu ịhapụ ụlọ ọrụ mmepụta ihe, a na-agbakwunye akụkọ nyocha nke ọma

4.free samples, kpọtụrụ anyị ka anyị nweta free sample